It occurs to me, though I have never done it, that the wear area is around the tumbler hole, so why not simply case harden that area. With an oxy/acet torch and some Kasenit or some such, one could heat sink the area soldered - I assume the pan - and harden just the hole and its vacinity. Or harden that area alone first, then solder on the pan, again protecting the cased area with a heat sink.